Boulder, CO – October 28, 2010 – Tech-X Corporation Signs AET, Inc. as Reseller – Presence in Japan Provides Local Support and Sales. Today Tech-X Corporation of Boulder, Colorado announced that they have signed a reseller agreement with AET, Inc. to represent sales of their VORPAL product. This arrangement will provide better local support for customers in the Japan. In order to provide a direct presence to better sell and support products in key geographic markets, Tech-X is expanding its international selling efforts by recruiting resellers. For more information on VORPAL, please visit http://vorpal.txcorp.com/.

Boulder, CO – October 25, 2010 – Tech-X Corporation will hold a VORPAL User Group Meeting (VUGM) during the upcoming APS Division of Plasma Physics meeting, being held at the Hyatt Regency Chicago on the Riverwalk from Nov 8 – 12. The VUGM will be held on Wednesday, November 10, from 12:30PM – 2:00PM in Skyway 265. See the Press Announcement for details.

Boulder, CO – October 14, 2010 – Tech-X Corporation invites you to visit us in Booth #119 at the AVS 57th International Symposium and Exhibition, October 17 - 22, in Albuquerque, NM. See the Press Announcement for details.

Boulder, CO – September 27, 2010 – Tech-X Corporation invites you to visit us at the 63rd Gaseous Electronics Conference, October 4 - 8, in Paris. See the Press Announcement for details.

Boulder, CO – September 20, 2010 – Tech-X Corporation of Boulder, Colorado, announces the release of GPULib v1.4. GPULib provides a library of mathematical functions that facilitate the use of high performance computing resources available on modern Graphics Processing Units (GPUs) by engineers, scientists, analysts, and other technical professionals. See the Press Announcement for details.

Boulder, CO – August 5, 2010 – Tech-X Corporation of Boulder, Colorado, announced the release of VORPAL v4.2. VORPAL is a software framework that enables electromagnetic and electrostatic simulations composed of particles and fluids for 1-D, 2-D, and 3-D geometries. New capabilities will allow researchers to apply VORPAL in new application areas and enable more advanced simulations of the physics being studied. See the Press Announcement for details.

Boulder, CO – August 5, 2010 – Tech-X Corporation invites you to visit us at the 21st International Conference on the Application of Accelerators in Research and Industry (CAARI), August 8 - 13., in , in Fort Worth, TX. See the Press Announcement for details.

Boulder, CO – July 23, 2010 – Tech-X Corporation invites you to visit us at our booth (Booth #508) at the 46th Joint Propulsion Conference and Exhibit, July 25 - 28, in Nashville, TN. See the Press Announcement for details.

Boulder, CO – July 1, 2010 – Tech-X Corporation recognised as Knowledge Business of the Year in Liverpool, UK for innovative software and infrastructure solutions, ranging from parallel computing to advanced simulation in the physics of particle accelerator design. See the Press Announcement for details.

Boulder, CO – June 15, 2010 – Tech-X Corporation invites you to visit us at Booth #3 at the 37th IEEE International Conference on Plasma Science, June 20 – 24 at the Marriott Waterside in Norfolk, VA. See the Press Announcement for details.

Boulder, CO – June 14, 2010 – Tech-X Corporation industry sponsor at the 2010 Advanced Accelerator Concepts Workshop, June 13 - 19 in Annapolis, MD. See the Press Announcement for details.

Boulder, CO – May 19, 2010 – Tech-X Corporation invites you to visit us at Booth #11 at the 1st International Particle Accelerator Conference, May 23 - 28 in Kyoto, Japan. See the Press Announcement for details.

Boulder, CO – May 17, 2010 – Tech-X Corporation invites you to visit us at Booth #8 at the IEEE International Power Modulator and High Voltage Conference, May 23 - 27 in Atlanta, Georgia. See the Press Announcement for details.

Boulder, CO – May 12, 2010 – Tech-X Corporation invites you to visit us at Booth #705 at the IEEE MIT 2010 International Microwave Symposium, May 23 - 28 in Anaheim, California. See the Press Announcement for details.

Boulder, CO – May 5, 2010 – Tech-X Corporation invites you to visit us at Table #2 at the 11th IEEE International Vacuum Electronics Conference, May 18 - 20 in Monterey, California. See the Press Announcement for details.

Boulder, CO – April 23, 2010 – Tech-X Corporation is pleased to host the DIAMP Workshop June 14 – June 16, 2010 at Tech-X Corporation headquarters in Boulder, Colorado.

Boulder, CO – March 10, 2010 – Tech-X Corporation of Boulder, Colorado, announces subsidiary in Switzerland, located in Zurich. By creating a local presence, Tech-X can better service the growing market for their software products and consulting services in physics simulations and high-performance computing. See the Press Announcement for details.

Boulder, CO – February 25, 2010 – Tech-X Corporation Signs Bright-Tech Information Technology Co., Ltd. as Reseller. Presence in China Provides Local Support and Sales. Tech-X Corporation of Boulder, Colorado, announced that they have signed a reseller agreement with Bright-Tech Information Technology Co., Ltd. to represent sales of their VORPAL product. This arrangement will provide better local support for customers in the China. In order to provide a direct presence to better sell and support products in key geographic markets, Tech-X is expanding its international selling efforts by recruiting resellers. See the Press Announcement for details.

Boulder, CO – February 19, 2010 – Tech-X Corporation invites you to visit us at our booth at the SIAM Conference on Parallel Processing for Scientific Computing (PP10), to take place February 24 – 26, 2010 in Seattle, WA at the Grand Hyatt Seattle. See the Press Announcement for details.

February 8 in Daresbury, Cheshire, UK: Tech-X Corporation announces opening of UK operations co-located at the Daresbury Science and Innovation Campus (Daresbury SIC) in collaboration with The Cockcroft Institute (the National Centre for Accelerator Science and Technology). See the Press Announcement for details.

January 26 - 28 in San Francisco, CA: Tech-X Corporation invites you to visit us in Booth #2228 in the Colorado Cluster at Photonics West. See the Press Announcement for details.

December 14 in Boulder, CO: Tech-X Corporation wins AVS-56 Innovation Award sponsored by Physics Today for our VORPAL. multi-physics simulation software for modeling the interaction of matter with electromagnetic fields. The award will be formally announced in the January issue of Physics Today.

December 14 - 18, 2009, in San Francisco, CA: Tech-X Corporation invites you to visit us in Booth 532, at the American Geophysical Union Fall Meeting (AGU).We will be demonstrating the Remote Data Toolkit, which allows seamless access to remote data with IDL, as well as VORPAL, our highly-configurable multiphysics simulation application for modeling the interaction of matter with electromagnetic fields, and GPULib, our library of mathematical kernels for GPU computing. See the Press Announcement for details.

November 14 - 20, 2009, in Portland, OR: Tech-X Corporation invites you to visit us in Booth 1713, at SC09, where we will be demonstrating VORPAL. We will also be demonstrating GPULib in Microway's Booth 434. On Wednesday in Room E147-148, join Svetlana Shasharina, Ph.D. for the presentation, "VizSchema: A Unified Interface for Visualization of Scientific Data." See the Press Announcement for details.

November 8 - November 13, 2009 in San Jose, CA: Tech-X Corporation invites you to visit us at the American Vacuum Society 56th International Symposium and Exhibition (AVS). See the Tech-X DPP 2009 Press Announcement for the Tech-X details.

November 2 - November 6, 2009 in Atlanta, GA: Tech-X Corporation invites you to visit us at the 51st Annual Meeting of the Division of Plasma Physics (DPP). See the Tech-X DPP 2009 Press Announcement for the Tech-X details.

October 20 - October 23, 2009 in Saratoga Springs, NY: Tech-X Corporation invites you to visit us at the 62nd Gaseous Electronics Conference. See the Tech-X GEC 2009 Press Announcement for the Tech-X personnel poster schedule and lunch tutorial details.

October 7 - October 8, 2009 in Boulder, CO: Tech-X Corporation is pleased to host the next face-to-face NERSC User Group (NUG) meeting.

October 5 - October 6, 2009 in Boulder, CO: Tech-X Corporation is pleased to host the 2009 ComPASS All Hands Meeting. The focus of the meeting will be on reviewing the current state of development and application activities and on enhancing collaborative work.

September 20 - September 24, 2009 in Gatlinburg, TN: Tech-X Corporation invites you to visit us at our booth at the International Conference on Ion Sources. See the Tech-X ICIS Press Announcement for details.

August 31 - September 4, 2009 in San Francisco, CA: Several scientists from Tech-X Corporation present at the 10th International Computational Accelerator Physics Conference.

August 23 - 28 in Liverpool, UK: Tech-X Corporation is proud to present the latest release of our electromagnetic plasma simulation software, VORPAL 4.0 at the 31st International Free Electron Laser Conference from. Read the FEL Press Announcement details.

Boulder, Colorado – August 6, 2009 – Tech-X Corporation researchers' image chosen for display in the online journal Kaleidoscope. Physical Review Special Topics Accelerators and Beams, publishers of Kaleidoscope, has selected Figure 3 from Wakefields in photonic crystal cavities by Gregory R. Werner, Carl A. Bauer, and John R. Cary. Featured images are selected for display based on aesthetic merit.

Boulder, CO – August 6, 2009 – Tech-X Corporation hosts the FACETS collaboration meeting. In addition to presentations and discussions about FACETS, there will also be discussions about frameworks for integrated modeling of fusion confinement devices.

Boulder, CO – July 29, 2009 - Tech-X Corporation invites you to visit us at Booth #717 at the 45th Joint Propulsion Conference and Exhibit from August 2 - 5, 2009, in Denver, CO. We are proud to present the latest release of our electromagnetic plasma simulation software, VORPAL 4.0 provides for the first time parallel and multi-core capability to the Windows platform (as with previous versions of VORPAL, VORPAL 4.0 also runs in parallel on the Linux and Macintosh platforms).

May 18, 2009 -- Join Tech-X at the 17th IEEE International Pulsed Power Conference (PPC2009) June 28 – July 2, 2009 in Washington DC. Visit us in Booth 101.

May 18, 2009 -- Visit Tech-X at PhotonXpo 2009, The Exhibit At CLEO in Baltimore, Maryland from May 31 – June 5, 2009. Join us in Booth 1838.

May 18, 2009 -- See Tech-X at ICOPS, 36th International Conference on Plasma Science and 23rd Symposium on Fusion Engineering in San Diego May 31st - June 5th!

May 11, 2009 -- Tech-X Corporation of Boulder, Colorado, announced the release of VORPAL v4.0. VORPAL is a software framework that enables electromagnetic and electrostatic simulations composed of particles and fluids for 1-D, 2-D, and 3-D geometries. New capabilities will allow researchers to apply VORPAL in new application areas and enable more advanced simulations of the physics being studied. For more details, see the VORPAL press release or the VORPAL product page.

May 4, 2009 -- Please join us at PAC09, the Particle Accelerator Conference in Vancouver, BC, Canada May 4 - 8. Stop by and visit us in Booth 11.

March 27, 2009 -- Please join us at the World Wildlife Fund in Washington DC to learn more about GPULib and how you can use it with IDL and ENVI. Tech-X Corporation will be conducting a hands-on training session for GPULib starting at 5:00 PM on April 15. This will follow immediately after VISualize 2009, hosted by ITT Visual Information Solutions.

February 27, 2009 -- GPULib 1.0.8 has been released -- this version contains several bug fixes, as well as new licensing terms. See the GPULib product page for more information.

February 09, 2009 -- VORPAL has been instrumental in guiding design modifications of the proposed electron cooling system for the Relativistic Heavy Ion Collider (RHIC) at Brookhaven National Laboratory, providing substantial cost savings to the project. Complete details can be found in the VORPAL success story about BNL.

February 05, 2009 -- OOPIC Pro has been updated to version 2.0.2; users can download the evaluation or contact sales@txcorp.com for upgrade information for existing customers.

January 9, 2009 -- Tech-X is pleased to be collaborating with the University of Colorado at Boulder on two recently-announced lunar research grants. The grants, totaling $11 million, were awarded from NASA's Lunar Science Institute and focus on probing the cosmos from observatories on the moon and conducting science and safety investigations on the dusty lunar surface and its atmosphere.

February 09, 2009 -- VORPAL has been instrumental in guiding design modifications of the proposed electron cooling system for the Relativistic Heavy Ion Collider (RHIC) at Brookhaven National Laboratory, providing substantial cost savings to the project. Complete details can be found in the VORPAL success story about BNL.

February 05, 2009 -- OOPIC Pro has been updated to version 2.0.2; users can download the evaluation or contact sales@txcorp.com for upgrade information for existing customers.

January 9, 2009 -- Tech-X is pleased to be collaborating with the University of Colorado at Boulder on two recently-announced lunar research grants. The grants, totaling $11 million, were awarded from NASA's Lunar Science Institute and focus on probing the cosmos from observatories on the moon and conducting science and safety investigations on the dusty lunar surface and its atmosphere.

November 18, 2008 -- We are pleased to announce the first major release of GPULib. This library allows scientists, engineers, and developers take advantage of GPU hardware to accelerate applications in a variety of languages, including IDL and MATLAB. For more information, see the GPULib product page or the GPULib development blog.

November 17, 2008 -- Tech-X Corporation announced that they have signed a reseller agreement with TAE SUNG ANST, Inc. to represent sales of their VORPAL product. This arrangement will provide better local support for customers in the Republic of Korea. For more details, please see the press release.

November 06, 2008 -- PhysOrg.com has an article about our research into accelerating heavy ions with laser-plasma interactions. This exciting work may eventually have application in cancer treatments.

September 03, 2008 -- Tech-X has released a new version of the cross-platform particle-in-cell simulation software OOPIC Pro. Version 2.0.0 adds several improvements to the application, including support for parallel computations on Linux platforms. For more information, please see the OOPIC Pro product page.

August 25, 2008 -- The magazine Computing in Science and Engineering is currently running a piece authored by several Tech-X researchers. The article by Alexander Pletzer, Douglas McCune, Stefan Maszala, Srinath Vadlamani, and Scott Kruger, "Exposing Fortran Derived Types to C and Other Languages" appears in the Scientific Programming section.

August 13, 2008 -- The definitive article on electron cooling simulations in VORPAL has been accepted for publication. The paper, "Simulating the dynamical friction force on ions due to a briefly co-propagating electron beam", can be viewed at http://dx.doi.org/10.1016/j.jcp.2008.06.019

July 17, 2008 – Tech-X Corporation was one of the recipients of a SciDAC award for visualization at the annual meeting of the U.S. Department of Energy’s Scientific Discovery through Advanced Computing (SciDAC) program held in Seattle July 13–17. SciDAC held an Electronic Visualization and Poster night July 13 as part of its 2008 meeting. Fifty-two entries took part in the competition, and 10, including the Tech-X entry, won OASCR (for Office of Advanced Scientific Computing Research) awards. Click here for more...

April 29, 2008 - An update of VorpalView has been released. You can download VorpalView 3.0.4 from the VorpalView product page.

February 21, 2008 - Tech-X Corporation announced the release of GPULib as a technology demonstration. This software library executes vectorized mathematical functions on graphics processing units (GPUs) from NVIDIA, bringing high-performance numerical operations to everyday desktop computers. More details can be found in the GPULib press release and the GPULib technology page.

February 19, 2008 - Tech-X Corporation announced the release of VORPAL v3.0. VORPAL is a software framework that enables plasma simulations composed of particles and fluids for 1-D, 2-D, and 3-D geometries. New capabilities will allow researchers to apply VORPAL in new application areas and enable more advanced simulations of the physics being studied. For more details, see the VORPAL press release or the VORPAL product page.

October 17, 2007 - Tech-X will be hosting a VORPAL User's Group meeting in Orlando, FL before the American Physical Society Division of Plasma Physics Meeting (APS DPP). Topics to be covered include input, visualization, as well as upcoming features and new calculations. If you are interested in attending, please RSVP by sending email to sales@txcorp.com.

June 15, 2007 - VORPAL v2.2 has been released. VORPAL is a software framework that enables plasma simulations composed of particles and fluids for 1-D, 2-D, and 3-D geometries. New capabilities will allow researchers to apply VORPAL in new application areas and enable more advanced simulations of the physics being studied. New capabilities include a re-architecting of the product documentation, as well as the ability to describe more complex geometries of physical problems and the addition of new physics capabilities. This release also provides support for the Intel-based Mac OS X platform. More information can be found on the VORPAL product page.

April 19, 2007 - TxPhysics 1.0.0 has been released by Tech-X. This physics library includes models for impact ionization of neutral gases by electrons and ions, field-induced tunneling ionization of atoms, ion range and stopping power in solids, ion-induced electron yield from solids, and secondary electron yields. The code is cross-platform, and the library functions can be called from C, Java, or Python. More information can be found on the TxPhysics technology page.

November 13, 2006 - Tech-X is pleased to announce the release of VORPAL v2.0.0, a software framework that enables plasma simulations composed of particles and fluids for 1-D, 2-D, and 3-D geometries of arbitrary complexity. New capabilities available as part of this release allow VORPAL to solve a wider array of problems, with more accurate representations of the geometry of various components being modeled, and more advanced simulations of the physics being studied. More information can be found in the press release or the VORPAL product page.

November 10, 2006 - Tech-X is pleased to announce the release of FastDL v2.0.0, a software framework that enables parallel computations with IDL from ITT Visual Information Solutions. With this release the performance and robustness of TaskDL, one of the components of FastDL, has been greatly enhanced. More information can be found in the press release or the FastDL product page.

September 07, 2006 - The U.S. Department of Energy's Office of Science announced recipients of the recent Scientific Discovery through Advanced Computing (SciDAC) grants. John Cary, CEO of Tech-X Corporation, is the principal investigator for the new SciDAC work developing a multi-physics, parallel framework application (FACETS) for full-scale fusion reactor modeling. Full details about this project can be found at http://www.scidac.gov/fusion/fullscale.html.

February 03, 2006 - Tech-X Corporation is proud to be one of the 15 teams awarded computation time as part of the Department of Energy's Innovative and Novel Computational Impact on Theory and Experiment (INCITE). We look forward to applying these leadership-class supercomputing resources to our research. More information on the INCITE awards can be found at http://www.lbl.gov/CS/Archive/news013106.html.

November 14, 2005 - Tech-X Corporation releases CoReViz, a collaborative environment for visualization of remotely-generated simulation data. See the CoReViz product page for more information.

November 7, 2005 - Ordering products has been made much easier thanks to our improved online store. Products can now be delivered as downloads as well as on CD!

October 22, 2005 - Tech-X Corporation releases VORPAL, simulation code for solving complex problems in plasma physics. See the VORPAL product page for more information.

July 22, 2005 - Tech-X Corporation and Research Systems, Inc. (RSI) release FastDL, bringing the benefits of cluster computing to IDL users. See the FastDL product page for more information.

December 21, 2004 - "Composite mesostructures by nano-confinement" published in Nature - Materials co-authored by Scott Sides of Tech-X Corporation. See Nature Materials at http://www.nature.com/nmat/.

November 10, 2004 - OptSolve++ version 2.1 C++ optimization library available.

September 30, 2004 - VORPAL simulation software used in accelerator technology break through announced in Nature. See the press release the 30 September 2004 issue of Nature for more information.

September 20, 2004 - OOPIC Pro Version 1.0 now available! Visit the OOPIC Pro product pages for more information about the plasma and charged particle simulation capabilities of OOPIC Pro and about special student pricing. While you are there, register to win one of three Z-Bolt(TM) green laser pointers and download an evaluation version of OOPIC Pro.

September 20, 2004 - OOPIC Pro Version 1.0 press release: Tech-X Corporation Releases OOPIC Pro Simulation Software to Improve Plasma Physics Education.

September 19, 2004 - CORBA-4GL update available. Visit CORBA-4GL for more information or downloads to get the latest.

July 20, 2004 - CORBA-4GL now available. The evaluation version of CORBA-4GL for RSI's IDL is now available for download. Visit CORBA-4GL for more information or downloads to get the latest.

August 3, 2004 - OOPIC Pro Beta4 now available for Windows, Linux and Mac OS X. The evaluation version of OOPIC Pro is now available for download. Visit OOPIC Pro for more information or downloads to get the latest.

June 26, 2004 - OOPIC Pro now available for OS X! The evaluation version of OOPIC Pro for Mac OS X is now available for download. Visit downloads to get the latest.

May 3, 2004 - Updated OOPIC Pro for Windows is now available. Evaluation period ends August 3, 2004. Visit downloads to get the latest version.

April 22, 2004 - Nanbor Wang will present results of research on real-time CORBA Component Model (CCM) technologies at the OMG's real-time workshop in Washington, DC, July 12-15, 2004. The title of Dr. Wang's talk is "A QoS-enabled CORBA Component Model for Distributed Real-Time and Embedded System Development." Details of the workshop are available at the conference Web site.

April 15, 2004 - OOPIC Pro Beta 3 Windows and Linux versions now available. Visit Downloads to get the latest releases.

March 30, 2004 - New demos online now! Go to the Modeling Application Portal - OOPIC Web to run plasma simulations through your Web browser.

March 18, 2004 - New demos and downloads available at txcorp.com. See the Geometric Optics demo applet and the new FarSight remote visualization demo.

March 15, 2004 - Tech-X Corporation announces that it will host the Fusion Simulation Project (FSP) workshop at the Tech-X Corporation offices May 18-20, 2004.

January 20, 2004 - Tech-X Corporation is please to announce that Scott Kruger, PhD joined our team of scientists and software developers.

January 16, 2004 - Tech-X Corporation moved to new offices on Arapahoe Avenue in Boulder, CO. See Contact Us for our new address, a map to our offices and to access a phone directory.

December 15, 2003 - OptSolve++ Version 2.0 shipped. Support for the latest version of MS Visual C++ was added. Also, architectural changes to increase flexibility and extensibility were made. See Products for more information.

December 01, 2003 - Tech-X Corporation released Version 0.9beta1 of the CMEE Library. Tech-X Corporation also announces an agreement with Mission Research Corporation to adapt the LSP application for use with the CMEE Library.

November 15, 2003 - Tech-X Corporation releases Version 0.9beta1 of the IONPACK Library. Tech-X Corporation also announces an agreement with Mission Research Corporation to adapt the LSP application for use with the IONPACK Library.

April 16, 2002 - Tech-X Corporation releases QScimpl Version 1.0b3.