January 2017 Tech-X Newsletter
NEWS

VSim Enables Design of More Powerful Photonics-based Particle Accelerators

VSim Predicts Sheath Characteristics in Sputtering Magnetrons

New USim Algorithms Reproduce GEC Reference Cell Data for Inductively Coupled Plasmas

Tech-X Scientist Jonathan Smith Boosts PUFFIN Capabilities: Free Electron Laser Design Software Made More Sustainable

CERN Affiliate Yisel Martinez Palenzuela Wins EurISOL Poster Prize Using VSim

Tech-X Simulations by Jake King Find High-PerformanceQH-mode DIII-D Discharges without Deleterious Edge Modes

David Rimel, Tech-X Intern, Receives Quadruple Honors from CU Boulder

Publications
Plasma Sheath Formation in Self-Consistent Planar Cylindrical Magnetron Sputtering Simulation
Above: Watch highlights of magnetron sputtering simulations from Tech-X's AVS 63 presentation.
Read the article. Watch the video.
Fluctuation-induced Convective Correlations
Above: A poloidal cut of the tokamak showing three contour lines, each of density (blue) and temperature (red) overlaying pseudocolor contours of flow normal to then n=0 magnetic field.
Read the article. Watch the video.
EVENTS

Tech-X will exhibit at the Hardened Electronics and Radiation Technology conference April 24-28, 2017 in Denver, Colorado, United States.

Visit Tech-X at the 18th International Vacuum Electronics Conference 24 - 26 April 2017 in London, UK.

Join Tech-X at the AVS 17th International Conference on Atomic Layer Deposition (ALD 2017) featuring the 4th International Atomic Layer Etching Workshop (ALE 2017) July 15-18, 2017 in Denver, Colorado, United States.

Tech-X will exhibit at 2017 European Microwave Week, 8-13 October in Nuremberg, Germany.

Visit Tech-X at the American Vacuum Society 64th International Symposium and Exhibition October 29-November 23, 2017 in Tampa, Florida, United States.

Tech-X to Exhibit at 44th ICOPS in Atlantic City, New Jersey.
About Tech-X Corporation
Tech-X creates high-performance computational software for simulation and design technology used in research and engineering. Tech-X employs excellence in the fields of physics, engineering, applied mathematics, computer science, and software engineering to produce software by experts for experts. We engineer superior solvers to attack unique and difficult problems in the interaction of electromagnetics with complex materials.

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