VSim & USim Workshop at ICOPS, May 28, 2014

Boulder, Colorado - April 29, 2014:

Join Tech-X for a VSim and USim workshop at ICOPS!

Tech-X Corporation will hold a VSim and USim Workshop on Wednesday May 28, 2014 at ICOPS, the 41st IEEE International Conference on Plasma Science and the in Washington, DC.

We will be presenting our newest user-requested features for our PIC/PIC-MCC code, VSim, as well as the latest plasma fluid modeling features of USim.

Boulder, Colorado - April 29, 2014:

Join Tech-X for a VSim and USim workshop at ICOPS!

Tech-X Corporation will hold a VSim and USim Workshop on Wednesday May 28, 2014 at ICOPS, the 41st IEEE International Conference on Plasma Science and the in Washington, DC.

We will be presenting our newest user-requested features for our PIC/PIC-MCC code, VSim, as well as the latest plasma fluid modeling features of USim.

Free demonstration versions of the software will be provided for demos and one-on-one discussions.

All are welcome to attend and no registration is required.

Date: Wednesday, May 28, 2014

Time: 2:00 pm - 5:00 pm (coffee and snacks will be served)

Location: Truman Room

VSim Demonstration: Some of the latest features for VSim Version 7 that will be presented are:

  • fast grid generation from CAD files
  • enhanced external circuit modeling capabilities
  • improved surface interactions for complex geometries


USim Demonstration: The USim overview will highlight hypersonic reentry results that demonstrate the latest features of USim 2.

Feel free to contact us in advance to arrange for a one-on-one meeting.

Ready to evaluate VSim|USim|PSim for free?

 

 

 

     
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